Veille CVE
CVE-2024-43047
7.8 Élevée Exploitée activementCatalogue CISA KEV — Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Ajoutée le 08/10/2024 · Échéance de correction (agences US) : 29/10/2024
Action requise : Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Description
Memory corruption while maintaining memory maps of HLOS memory.
Produits concernés
- Qualcomm, Inc. Snapdragon
- qualcomm fastconnect_6700_firmware
- qualcomm fastconnect_6800_firmware
- qualcomm fastconnect_6900_firmware
- qualcomm fastconnect_7800_firmware
- qualcomm qam8295p_firmware
- qualcomm qca6174a_firmware
- qualcomm qca6391_firmware
- qualcomm qca6426_firmware
- qualcomm qca6436_firmware
- qualcomm qca6574au_firmware
- qualcomm qca6584au_firmware
- qualcomm qca6595_firmware
- qualcomm qca6595au_firmware
- qualcomm qca6688aq_firmware
- qualcomm qca6696_firmware
- qualcomm qca6698aq_firmware
- qualcomm qcs410_firmware
- qualcomm qcs610_firmware
- qualcomm qcs6490_firmware
- qualcomm_video_collaboration_vc1_platform_firmware
- qualcomm_video_collaboration_vc3_platform_firmware
- qualcomm sa4150p_firmware
- qualcomm sa4155p_firmware
- qualcomm sa6145p_firmware
Scores CVSS
| Version | Score | Source | Vecteur |
|---|---|---|---|
| 3.1 | 7.8 Élevée | product-security@qualcomm.com | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
Faiblesses (CWE)
Références
- https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html PatchVendor Advisory
- https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2024-43047 US Government Resource